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SK Group Chairman Chey Tae-won met with TSMC CEO C.C. Wei in Taiwan to discuss collaboration in the semiconductor sector, focusing on AI and high-bandwidth memory (HBM) technology. This meeting follows a strategic partnership established in April 2024 between SK hynix and TSMC aimed at enhancing HBM production and advanced packaging capabilities, crucial for AI hardware performance. As SK hynix strengthens its position in the AI memory market, competition with Samsung intensifies, with SK hynix expected to lead in next-generation HBM4 development.
Taiwan Semiconductor Manufacturing Co. (TSMC) has announced a significant $100 billion expansion of its operations in the United States to boost semiconductor production. This move, revealed by CEO C.C. Wei, aligns with a broader trend of Taiwanese companies increasing their investments in the US, including Foxconn's collaboration with Apple on an AI server assembly site in Texas. Other firms like Wiwynn Corp., Quanta Computer Inc., and Compal Electronics Inc. are also making substantial investments in US facilities.
TSMC has unveiled a $100 billion investment plan in the US, driven by strong demand from American customers, with production lines at new facilities fully booked through 2027. CEO C.C. Wei noted that while expanding in the US, growth in Taiwan will also continue, with 11 new production lines planned this year compared to three in the US. This expansion comes amid rising geopolitical tensions surrounding semiconductor supply chains.
C. C. Wei
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SK Group and TSMC explore semiconductor collaboration for AI and memory technology
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10:00 11.04.2025
TSMC announces 100 billion dollar investment for US semiconductor expansion
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